Electronic component supply apparatus and electronic component supply method

ABSTRACT

An electronic component supply apparatus that transports a component supply tape which has accommodation sections and sprocket holes formed at regular intervals and which accommodates an electronic component in each of the accommodation sections, to a component picking-up position and that supplies the electronic component accommodated in the accommodation section to a component mounting apparatus, the electronic component supply apparatus includes a slippage detector that detects slippage occurring in a transport of the component supply tape by a component supply tape transport unit; and a transport correction unit that corrects the transport of the component supply tape by the component supply tape transport unit based on the slippage detected by the slippage detector.

CROSS-REFERENCES TO RELATED APPLICATION(S)

This application is based on and claims priority from Japanese PatentApplication No. 2015-001165 filed on Jan. 6, 2015 and Japanese PatentApplication No. 2015-001999 filed on Jan. 8, 2015, the entire contentsof which are incorporated herein by reference.

BACKGROUND

1. Field of the Invention

One or more embodiments of the present invention relate to an electroniccomponent supply apparatus that transports a component supply tapehaving an accommodation section in which an electronic component isaccommodated and that supplies the electronic component to a componentmounting apparatus, and an electronic component supply method.

2. Description of Related Art

As an electronic component supply apparatus of a component mountingapparatus that mounts an electronic component on a substrate, a tapefeeder that supplies electronic components in a mode of a componentsupply tape having a pocket-like accommodation section, in which theelectronic component is accommodated, is widely used. The componentsupply tape is set to a state of being wound and accommodated on a reeland having a predetermined length, and a mounting head of the componentmounting apparatus picks up the electronic component from the componentsupply tape transported to a component picking-up position by the tapefeeder. Then, when the component supply tape accommodated on one reel iscompletely unwound, reel replacement is performed, in which a new reelis set and the next component supply tape is additionally supplied.

As a reel replacement method, a so-called autoloading method in which itis possible to additionally insert a subsequent following componentsupply tape (following tape) when components are depleted in thepreceding component supply tape (preceding tape) is known (see PatentDocument 1, for instance). In this method, in addition to a tape feedingmechanism which feeds the component supply tape by pitch along thetransport path to the component picking-up position, an inserted-tapefeeding unit that feeds a newly inserted following tape to the tapefeeding mechanism is separately provided, a sprocket hole on the leadingportion of the inserted subsequent tape engages with a sprocket of thepreceding-tape feeding mechanism, and thereby, the subsequent tape isfed to the component picking-up position.

-   Patent Document 1 is JP-A-2014-11291.

SUMMARY

However, the above-described related art has difficulties as follows.That is, in the related art, since the subsequent tape is pushed only tomove from the upstream side along the transport path by a tape insertingunit and is not held at an exact position, a stable position or postureof the component supply tape in a thickness direction thereof is notnecessarily secured. Hence, in some cases, so-called “slippage” occurs,which means that smooth engagement is not performed between a sprockethole on the leading portion of the subsequent tape and a feeding pin ofa sprocket of a tape drive mechanism, and disengagement slippage occursbetween the feeding pin and the component supply tape.

When such “slippage” occurs, a tape feeding amount which has to beachieved through the normal tape feeding by the tape feeding mechanismis not equal to a tape feeding amount achieved by actual feeding drivethrough engagement of the feeding pin with the sprocket hole. As aresult, in a state in which the subsequent tape is fed to the componentpicking-up position, it is not possible to accurately position thesubsequent tape with respect to a suction nozzle of the mounting headand it is not possible to accurately perform a so-calledheading-of-component operation in which the leading component of thesubsequent tape, which should be a component picking-up target, ispositioned exactly at the component picking-up position. In such therelated art, a so-called automatic loading method in which it ispossible to additionally insert the subsequent component supply tapewhen the components are depleted in the preceding component supply tape,has a problem in that it is difficult to position the subsequentcomponent supply tape exactly at the component picking-up position.

One or more embodiments of the present invention aim to provide anelectronic component supply apparatus in which it is possible toposition a subsequent component supply tape exactly at a componentpicking-up position and an electronic component supply method.

According to an aspect of the embodiments, there is provided anelectronic component supply apparatus that transports a component supplytape which has a plurality of accommodation sections and sprocket holesformed at regular intervals and which accommodates an electroniccomponent in each of the accommodation sections, to a componentpicking-up position and that supplies the electronic componentaccommodated in the accommodation section to a component mountingapparatus, the electronic component supply apparatus including: a mainbody unit which is provided with a transport path that guides thecomponent supply tape from an insertion port, through which thecomponent supply tape is inserted, to a discharge port, through whichthe component supply tape is discharged; an inserted tape feeding unitthat transports the component supply tape inserted through the insertionport toward the discharge port along the transport path; a componentsupply tape transport unit that transports the component supply tapetransported along the transport path, toward the discharge port, andpositions the accommodation section at the component picking-up positionon an upstream side from the discharge port; a slippage detector thatdetects slippage occurring in the transport of the component supply tapeby the component supply tape transport unit; and a transport correctionunit that corrects the transport of the component supply tape by thecomponent supply tape transport unit based on the slippage detected bythe slippage detector.

According to another aspect of the embodiments, there is provided anelectronic component supply apparatus that transports a component supplytape which has a plurality of accommodation sections and sprocket holesformed at regular intervals and which accommodates an electroniccomponent in each of the accommodation sections, to a componentpicking-up position and that supplies the electronic componentaccommodated in the accommodation section to a component mountingapparatus, the electronic component supply apparatus including: a mainbody unit which is provided with a transport path that guides thecomponent supply tape from an insertion port, through which thecomponent supply tape is inserted, to a discharge port, through whichthe component supply tape is discharged; an inserted tape feeding unitthat transports the component supply tape inserted through the insertionport toward the discharge port along the transport path; an electroniccomponent detecting unit that detects an electronic componentaccommodated in the accommodation section of the component supply tapein the transport path; a component supply tape transport unit thattransports the component supply tape transported along the transportpath, toward the discharge port, and positions the accommodation sectionat the component picking-up position on an upstream side from thedischarge port; a slippage detector that detects slippage occurring inthe transport of the component supply tape by the component supply tapetransport unit; and a transport correction unit that corrects thetransport of the component supply tape by the component supply tapetransport unit based on the slippage detected by the slippage detectorand transports the electronic component detected by the electroniccomponent detecting unit to a predetermined position.

According to still another aspect of the embodiments, there is providedan electronic component supply method of transporting a component supplytape which has a plurality of accommodation sections and sprocket holesformed at regular intervals and which accommodates an electroniccomponent in each of the accommodation sections, to a componentpicking-up position, and supplying the electronic component accommodatedin the accommodation section to a component mounting apparatus, theelectronic component supply method including: transporting the componentsupply tape having a leading end portion inserted through an insertionport of a transport path toward a discharge port of the transport pathby an inserted tape feeding unit; detecting a leading electroniccomponent of the component supply tape in the transporting of thecomponent supply tape; transferring the leading end portion of thecomponent supply tape to a component supply tape transport unit disposedon a discharge port side of the transport path; detecting slippage ofthe component supply tape in the transferring of the leading endportion; and transporting the leading electronic component to apredetermined position by performing an additional transport operationcorresponding to the detected slippage by the component supply tapetransport unit.

According to the embodiments, it is possible to position a subsequentcomponent supply tape exactly at a component picking-up position.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is an explanatory diagram illustrating a configuration of anelectronic component supply apparatus of an embodiment of the presentinvention.

FIGS. 2A to 2C are explanatory diagrams illustrating configurations ofcomponent supply tapes as supply targets of the electronic componentsupply apparatus of the embodiment of the present invention.

FIGS. 3A and 3B are explanatory diagrams for illustrating aconfiguration of a sensor unit used in the electronic component supplyapparatus of the embodiment of the present invention.

FIGS. 4A and 4B are explanatory diagrams illustrating output waveformsof the sensor unit used in the electronic component supply apparatus ofthe embodiment of the present invention.

FIG. 5 is an explanatory diagram illustrating output forms of acomponent detecting sensor and a sprocket hole detecting sensor in thesensor unit used in the electronic component supply apparatus of theembodiment of the present invention.

FIG. 6 is an explanatory diagram illustrating component presence/absencedetection by the sensor unit used in the electronic component supplyapparatus of the embodiment of the present invention.

FIG. 7 is a block diagram illustrating a control processing function ofthe electronic component supply apparatus of the embodiment of thepresent invention.

FIG. 8 is an explanatory diagram illustrating a tape transport operationin the electronic component supply apparatus of the embodiment of thepresent invention.

FIG. 9 is an explanatory diagram illustrating the tape transportoperation in the electronic component supply apparatus of the embodimentof the present invention.

DETAILED DESCRIPTION

Next, an embodiment of the present invention will be described withreference to the drawings. First, a configuration of a tape feeder 1 asan electronic component supply apparatus will be described withreference to FIG. 1. The tape feeder 1 has functions of transporting acomponent supply tape 20 (refer to FIGS. 2A to 2C) having accommodationsections in which electronic components are accommodated, to a componentpicking-up position, and of supplying the electronic componentsaccommodated in the accommodation sections to a component mountingapparatus.

As illustrated in FIG. 1, the tape feeder 1 is configured to include amain body unit 1 a and a mounting section 1 b provided to protrudedownward from an undersurface of the main body unit 1 a. In a state inwhich the undersurface of the main body unit 1 a is mounted along afeeder base of the component mounting apparatus (not illustrated), thetape feeder 1 is fixed to and mounted on the feeder base, and aninternal controller 15 for controlling tape feeding in the tape feeder 1is connected to an apparatus controller (not illustrated) of thecomponent mounting apparatus. An operation/display panel 16 connected tothe controller 15 is provided on the top surface of the main body unit 1a and enables operational input or display required for operation orstate display of the tape feeder 1 to be performed.

A transport path 2 that guides the component supply tape 20 insertedinto the tape feeder 1 is provided inside the main body unit 1 a. Thetransport path 2 is provided to communicate between an insertion port 2a which is opened at an end portion of the tape feeder 1 on an upstreamside (left side in FIG. 1) in a tape feeding direction and through whichthe component supply tape 20 is inserted, and a discharge port 2 b whichis opened at an end portion on a downstream side and through which thecomponent supply tape 20 is discharged.

A feeding sprocket 3 is disposed on the upstream side of the transportpath 2 in the vicinity of the insertion port 2 a. The feeding sprocket 3is mounted, through a one-way clutch mechanism, on a drive shaft 4 whichis driven by a feeding motor 3M (refer to FIG. 7). A feeding sprocketsensor 3 a is provided at a joining portion between the feeding sprocket3 and the drive shaft 4 and is configured to include an encoder whichdetects that the component supply tape 20 inserted through the insertionport 2 a engages with the feeding sprocket 3. The feeding sprocketsensor 3 a detects the engagement of the component supply tape 20 withthe feeding sprocket 3 and thereby, the feeding motor 3M starts driving.In this manner, the component supply tape 20 is transported to thedownstream side, that is, toward the discharge port 2 b along thetransport path 2.

In the tape feeding of the component supply tape 20 by the feedingsprocket 3, the feeding sprocket 3 is joined to the drive shaft 4through the one-way clutch mechanism. The one-way clutch mechanismallows the drive shaft 4 of the feeding sprocket 3 to only rotate in adirection relative to the tape feeding direction. In this manner, adrive force transmitted from the drive shaft 4 to the feeding sprocket 3is limited to rotation in the tape feeding direction. In addition, sincethe feeding sprocket 3 is freely rotatable in the tape feeding directionregardless of the rotation of the drive shaft 4, the component supplytape 20 engaging with the feeding sprocket 3 moves in the tape feedingdirection with no impediment. In the configuration described above, thefeeding sprocket 3 driven by the feeding motor 3M functions as aninserted tape feeding unit that transports the component supply tape 20inserted through the insertion port 2 a toward the discharge port 2 balong the transport path 2.

A following-tape detecting sensor 8 and a following-tape stopper 9 aredisposed on the downstream side of the transport path 2 from the feedingsprocket 3. In a state in which the tape feeding of a precedingcomponent supply tape 20 (hereinafter, described as a preceding tape 20(1)) fed as a component picking-up target is continuously performed, thefollowing-tape stopper 9 has a function of causing a leading end portionof a following component supply tape 20 (hereinafter, described as afollowing tape 20 (2)) additionally inserted through the insertion port2 a to come into contact with the following-tape stopper 9 and to stopthe following tape 20 (2). The following-tape detecting sensor 8 detectsthat the following tape 20 (2) stopped in contact with thefollowing-tape stopper 9 is present.

An intermediate sensor 10 is disposed on the downstream side on thetransport path 2 from the following-tape stopper 9, and a sensor unit 11is disposed further on the downstream side from the intermediate sensor10. The intermediate sensor 10 corresponds to a tape detecting sensorand detects shapes regularly formed on the component supply tape 20 ofend portions of the component supply tape 20, that is, a terminal endportion of the preceding tape 20 (1) and a leading end portion of thefollowing tape 20 (2), further, an accommodation section 21 a, asprocket hole 21 b, or the like, substantially at an intermediateposition of the transport path 2 and thereby the intermediate sensor 10detects that the component supply tape 20 is present or has passedthrough. As the tape detecting sensor, a sensor other than theintermediate sensor 10 may be disposed on the transport path 2 as longas the sensor has a function of detecting the component supply tape 20.

The sensor unit 11 detects the presence or absence of an electroniccomponent P in the accommodation section 21 a (refer to FIGS. 2A and 2B)of the component supply tape 20 having the following configuration.Here, with reference to FIGS. 2A and 2B, the configuration of thecomponent supply tape 20 is described. As illustrated in FIG. 2A andFIG. 2B, the component supply tape 20 has a base paper tape 21 as a mainbody, in which the accommodation sections 21 a for accommodating theelectronic components P and sprocket holes 21 b for tape feeding areformed at regular intervals. Here, two accommodation sections 21 a areformed, for example, in one pitch of the sprocket hole 21 b.

A cover tape 22 and a bottom tape 23 adhere to the top surface and theundersurface of the base tape 21, respectively, within a range in whichthe accommodation sections 21 a are formed such that the electroniccomponents P accommodated in the accommodation sections 21 a areprevented from dropping out. Before the electronic component P is pickedup out of the component supply tape 20, the cover tape 22 is peeled offfrom the base tape 21. That is, the target component supply tape 20according to the present embodiment is configured to have a plurality ofaccommodation sections 21 a in which the electronic components P areaccommodated and the sprocket holes 21 b formed at regular intervals andto accommodate the electronic components P in the accommodation sections21 a and to cover the electronic components P with the cover tape 22.

Both the cover tape 22 and the bottom tape 23 are optically transparentsuch that light radiating from below the bottom tape 23 is transmissibleto the upper side through a space inside the accommodation section 21 aand the cover tape 22. In the tape feeder 1 of the present embodiment,the light radiating from below the bottom tape 23 is received on theupper side of the cover tape 22 such that the presence or absence of theelectronic component P in the accommodation section 21 a is detected.

A component supply tape 20A illustrated in FIG. 2C corresponds to anembossed type tape used to supply relatively large-sized electroniccomponents. Embossed sections 21AE, in which each of the accommodationsections 21 a inside which each of the electronic components P can beaccommodated, are formed, are provided in a base tape 21A. In thecomponent supply tape 20A, the cover tape 22 also adheres to the topsurface thereof within a range in which the accommodation sections 21 aare formed. Both the base tape 21A and the cover tape 22 are opticallytransparent or an opening is provided in the bottom of the embossedsection 21AE such that light radiating from below the base tape 21A istransmittable to the upper side through the space inside theaccommodation section 21 a and the cover tape 22.

A transport sprocket mechanism 7 is provided on the downstream side ofthe sensor unit 11 and is configured to cause a transport motor 7M(refer to FIG. 7) as the same drive source to drive a first sprocket 5and a second sprocket 6. The component supply tape 20 is insertedthrough the insertion port 2 a and is fed along the transport path 2 bythe feeding sprocket 3 and the leading end portion of the tape reachesthe transport sprocket mechanism 7. Then, the component supply tape 20engages with the first sprocket 5 and the second sprocket 6 to befurther fed to the downstream side and is transported to a componentpicking-up position 14 set on the upstream side from the discharge port2 b. A cover member 12 covers the upper side of the transport sprocketmechanism 7 and a cover-tape processing unit 13 is disposed on a backsurface of the cover member 12.

A peeling claw of the cover-tape processing unit 13 peels off the covertape 22 or a cutting blade cuts open the cover tape 22, on the upstreamside of the component picking-up position 14, from the component supplytape 20 which is fed by the transport sprocket mechanism 7, thereby theelectronic component P accommodated in the accommodation section 21 a isexposed. In this manner, it is possible to pick up the electroniccomponent P by a mounting head (not illustrated) provided in thecomponent mounting apparatus, from the accommodation section 21 a fed tothe component picking-up position 14. That is, the cover-tape processingunit 13 has functions of peeling off or cutting open the cover tape 22of the component supply tape 20 which has yet to reach the componentpicking-up position 14 and of exposing the electronic component Paccommodated in the accommodation section 21 a.

In the configuration described above, the transport sprocket mechanism 7corresponds to a component supply tape transport unit that transportsthe component supply tape 20 transported along the transport path 2,toward the discharge port 2 b and positions the accommodation section 21a at the component picking-up position 14 on the upstream side from thedischarge port 2 b. Then, the feeding sprocket 3 as the inserted tapefeeding unit and the transport sprocket mechanism 7 as the componentsupply tape transport unit configure a component supply tape transportunit that transports the component supply tape 20 inserted through theinsertion port 2 a toward the discharge port 2 b and positions theaccommodation section 21 a at the component picking-up position 14 onthe upstream side from the discharge port 2 b. The feeding sprocket 3and the transport sprocket mechanism 7 can perform both continuoustransport in which the component supply tape 20 is continuously fed andpitch transport in which the component supply tape 20 is intermittentlyfed, as necessary.

Next, with reference to FIGS. 3A and 3B, a configuration and a functionof the sensor unit 11 will be described. Sections (A) and (B) in FIG. 3Aillustrate a side view and a sectional view of the sensor unit 11,respectively, in a tape transport direction (refer to an arrow a). Asillustrated in FIG. 3A, the sensor unit 11 is configured to join alight-emitting section 11 b and a sensor section 11 c on the lowersection and an upper section of a plate-shaped unit base 11 a,respectively, which is disposed in a vertical orientation. Attachmentportions 26 protrude from side surfaces of the unit base 11 a andattachment holes 26 a are provided in the attachment sections 26 suchthat the sensor unit 11 is fixed to the main body unit 1 a through theattachment sections 26 by inserting fixing bolts (not illustrated)through the attachment holes 26 a and fastening the bolts to the framesection of the main body unit 1 a. In this manner, the sensor unit 11 isfixed to the main body unit 1 a through the attachment sections 26. Thecomponent supply tape 20 as a detecting target is fed through betweenthe top surface of the light-emitting section 11 b and the undersurfaceof the sensor section 11 c.

A light source 25 mounted to be fixed through a light-source mountingsection 25 a is disposed on the light-emitting section 11 b, in anorientation in which a light-emitting direction is set toward the upperside. The sensor section 11 c is irradiated with detecting light byturning on the light source 25. In the sensor section 11 c, a componentdetecting sensor 28 a and a sprocket hole detecting sensor 28 b aredisposed corresponding to positions of the accommodation section 21 aand the sprocket hole 21 b on the component supply tape 20 as thedetecting target. Further, an aperture section 27 is mounted on theundersurface of the sensor section 11 c and has a second hole 27 a and afirst hole 27 b which are provided corresponding to positions of thecomponent detecting sensor 28 a and the sprocket hole detecting sensor28 b. As described above, since the cover tape 22 and the bottom tape 23which adhere to the top and underside surfaces of the component supplytape 20 are optically transparent, inspection light radiating upward byturning on the light source 25 is transmitted through the accommodationsection 21 a and the sprocket hole 21 b and is emitted to the upperside. Then, the inspection light is focused through the second hole 27 aand the first hole 27 b and is received at the component detectingsensor 28 a and the sprocket hole detecting sensor 28 b.

FIG. 3B illustrates a positional relationship between a position of thecomponent detecting sensor 28 a and the second hole 27 a and a positionof the sprocket hole detecting sensor 28 b and the first hole 27 b inthe tape feeding direction. That is, the first hole 27 b and thesprocket hole detecting sensor 28 b positioned for detection of thesprocket hole 21 b as the detecting target are disposed toward theupstream side (left side in FIG. 3B) by a predetermined offset dimensionD in the tape feeding direction (an arrow b) from the componentdetecting sensor 28 a and the second hole 27 a positioned for detectionof the presence or absence of the electronic component P as thedetecting target in the accommodation section 21 a.

Here, with reference to FIGS. 4A and 4B, a description is provided aboutdetection waveforms output by the component detecting sensor 28 a andthe sprocket hole detecting sensor 28 b which receive the detectionlight radiating from the light source 25. FIGS. 4A and 4B illustrate thedetection waveforms obtained when the accommodation section 21 a and thesprocket hole 21 b are the detecting targets, respectively. In FIGS. 4Aand 4B, arrows depicted to penetrate through the component supply tape20 represent inspection light which radiates from the light source 25and transmits through the component supply tape 20.

First, sections (A) and (B) in FIG. 4A represent detection waveforms ina case where the electronic component P is present in the accommodationsection 21 a. The section (A) in FIG. 4A represents a detection waveformWa in a case where there are gaps 21 a 1 and 21 a 2 on both sides of theelectronic component P in the accommodation section 21 a and inspectionlight transmits upward through the gaps 21 a 1 and 21 a 2 and isreceived by the component detecting sensor 28 a. In this case, wheneverthe gaps 21 a 1 and 21 a 2 pass below the component detecting sensor 28a, the inspection light is received by the component detecting sensor 28a and two peaks Wa1 and Wa2 having sizes in accordance with a degree ofthe received light are acquired as the detection waveform Wa.

In addition, as illustrated in the section (B) in FIG. 4A, in a casewhere the electronic component P is positioned on one side in theaccommodation section 21 a and a gap 21 a 3 through which the inspectionlight is transmittable is present only on one side, the inspection lightis received by the component detecting sensor 28 a whenever the gap 21 a3 passes below the component detecting sensor 28 a and a detectionwaveform Wb formed of one peak having a size in accordance with a degreeof the received light is acquired.

As illustrated in a section (C) in FIG. 4A, in a case where noelectronic component P is positioned in the accommodation section 21 a,the inspection light that has been transmitted through the entire rangeof the component detecting sensor 28 a is received by the componentdetecting sensor 28 a and one detection waveform We having a size inaccordance with a light-receiving amount is acquired. The detectionwaveform Wc is characterized by a waveform width and a peak valuegreater than the detection waveforms Wa and Wb. Therefore, when thedetection waveform corresponds to the detection waveforms Wa and Wb, theelectronic component P is present in the accommodation section 21 a andthe detection waveform corresponds to the detection waveform Wc, theelectronic component P is not present in the accommodation section 21 a.Although omitted in the drawings, the detection waveform having almostno peak may be acquired in a case where the electronic component P ispresent. This case means that the size of the accommodation section 21 ahas small margin with respect to the size of the electronic component Pand almost no gap through which the inspection light is transmittable isformed.

Further, FIG. 4B illustrates a detection waveform Wd acquired when thesprocket hole 21 b passes the position of the sprocket hole detectingsensor 28 b. In this case, since the light radiated from the lightsource 25 is received by the component detecting sensor 28 a as theinspection light which has transmitted through the entire range of thesprocket hole 21 b, the detection waveforms Wd having a great waveformwidth and peak value are acquired at intervals corresponding to a holepitches of the sprocket holes 21 b and a tape feeding speed. Anevaluation parameter (a waveform width, a peak value, an integratedvalue, or the like) found from the acquired detection waveforms W iscompared to a preset threshold value and thereby, it is possible todetect the presence or absence of the electronic component P in theaccommodation section 21 a as the detecting target and the passing ofthe sprocket hole 21 b.

In the configuration described above, the light source 25, the secondhole 27 a, and the component detecting sensor 28 a configure anelectronic component detecting unit 24 a that detects the electroniccomponent P accommodated in the accommodation section 21 a of thecomponent supply tape 20, on the upstream side on the transport path 2from the component picking-up position 14. Similarly, the light source25, the first hole 27 b, and the sprocket hole detecting sensor 28 bconfigure a sprocket hole detecting unit 24 b that detects the sprockethole 21 b of the component supply tape 20 on the upstream side on thetransport path 2 from the component picking-up position 14. According tothe present embodiment, the electronic component detecting unit 24 a andthe sprocket hole detecting unit 24 b configure a single sensor unit 11.

Here, both the electronic component detecting unit 24 a and the sprockethole detecting unit 24 b are configured of an optical sensor thatincludes the shared light source 25 as the light-emitting section, andthe component detecting sensor 28 a and the sprocket hole detectingsensor 28 b as the light receiving section. That is, the sensor unit 11is configured to have the light source 25 in which an LED is used as asingle light source that emits light for detecting the sprocket hole andlight for detecting the electronic component and to have the componentdetecting sensor 28 a as the light receiving section for detecting theelectronic component and the sprocket hole detecting sensor 28 b as thelight receiving section for detecting the sprocket hole. In this manner,it is possible to realize a compact sensor unit 11 having a simplifiedconfiguration, which has both functions of the sprocket hole detectionand the electronic component detection.

Further, the optical sensor is configured to use the transmissivesensor; however, a reflective type sensor which receives reflected lightof the light radiating from the light emitting section, which isreflected from a detection target, as the inspection light, may be used.Further, as the sensor used as the electronic component detecting unit24 a, a magnetic detection type sensor that reacts to a metal portion ofthe electronic component P and outputs a detection signal may be usedinstead of the optical sensor.

According to the present embodiment, as illustrated in FIG. 3B, thesprocket hole detecting unit 24 b is disposed on the upstream side bythe predetermined offset dimension D from the electronic componentdetecting unit 24 a in the tape feeding direction. The employment ofsuch a configuration makes it possible to first detect the sprocket hole21 b, normally, of a pair of accommodation section 21 a and the sprockethole 21 b which are formed to be close to each other. The sprocket holedetection result is used as a reference and thereby, it is possible toreliably identify a detection signal corresponding to the subsequentaccommodation section 21 a and it is possible to perform efficient andhighly reliable detection of the presence or absence of the electroniccomponent P in the accommodation section 21 a. The sensor unit 11 may beused as the tape detecting sensor that detects the presence or thepassing of the component supply tape 20 on the transport path 2.

Next, with reference to FIG. 5, a correlation between the detectionsignals of the component detecting sensor 28 a and the sprocket holedetecting sensor 28 b in the sensor unit 11 will be described. In FIG.5, the output signals of the component detecting sensor 28 a and thesprocket hole detecting sensor 28 b are illustrated as waveforms usingtwo of upper and lower graphs, in which the horizontal axis is shared asthe time axis. In the lower graph corresponding to the output of thesprocket hole detecting sensor 28 b, the timings H1, H2, and H3 arrangedalong the horizontal axis which indicates a time series representingtimings at which the center of the sprocket hole 21 b passes thesprocket hole detecting sensor 28 b and the detection waveform Wdillustrated in FIG. 4B is acquired at each of the timings.

In the upper graph corresponding to the output of the componentdetecting sensor 28 a, timings P10, P15, P20, P25, and P30 arrangedalong the horizontal axis which indicates a time series representtimings at which the center of the accommodation section 21 a passes thecomponent detecting sensor 28 a and the detection waveform illustratedin FIG. 4A appears at each of the timings. As described above, thecomponent detecting sensor 28 a and the sprocket hole detecting sensor28 b have the positional relationship of being shifted by thepredetermined offset dimension D from each other in the tape feedingdirection. Hence, the detection waveform Wa of the accommodation section21 a adjacent to the sprocket hole 21 b appears after a detection delaytime T0 (T01 or T02) from the detection waveform Wd of the sprocket hole21 b.

Here, the sprocket holes 21 b are formed at regular pitches in thecomponent supply tape 20, however, practically, the component supplytape 20 does not always pass the sensor unit 11 in the tape feeder 1 ata regular speed, and variation is generated. In other words, since thecomponent supply tape 20 is fed in a tape feeding method in which thecomponent supply tape 20 is pushed from the upstream side to thedownstream side even when the feeding motor 3M is driven at a regularspeed, jamming is likely to occur, such as the component supply tape 20deformed in an undulated manner on the transport path 2 or partiallycrumpled component supply tape 20.

When such jamming occurs, the component supply tape 20 does not pass thesensor unit 11 at the regular speed. FIG. 5 illustrates an example inwhich the passing the intermediate sensor 10 is performed at a low speeddue to such jamming between the timings H1 and H2 and the passing isperformed at a high speed between the timings H2 and H3 because suchjamming is removed. In other words, even when the detection timing isdetermined in advance based on the driving by the feeding motor 3M,practically, the timing at which the accommodation section 21 a passesthe sensor unit 11 is highly likely to deviate from the predetermineddetection timing such that it is possible that false detection isperformed.

Thus, in the present embodiment, the timing at which the sprocket holes21 b formed in the component supply tape 20 at regular pitches pass thesensor unit 11 is detected, based on the timing, the detection waveformwhich is acquired when the accommodation section 21 a passes isidentified among the detection signals output from the componentdetecting sensor 28 a, and the presence or absence of the electroniccomponent P is determined based on the identified detection waveform.

According to the present embodiment, the sensor unit 11 described abovedetects the electronic component P in the accommodation section 21 a,with the component supply tape 20, which has yet to pass the cover-tapeprocessing unit 13 on the transport path 2, as the target. Therefore,posture stability in the accommodation section 21 a is ensured for theelectronic component P as the detecting target, due to the cover tape 22such that it is possible to achieve high reliability of the componentdetection. Further, a component detecting process is performed on theupstream side of the cover-tape processing unit 13 such that it ispossible to perform optical inspection without the influence of dust orthe like which is produced when the cover tape 22 is peeled off or cutopen.

Next, with reference to FIG. 7, a configuration and a processingfunction of the internal controller 15 in the tape feeder 1 will bedescribed. The controller 15 is connected to the transport motor 7M thatdrives the transport sprocket mechanism 7 and to the feeding motor 3Mthat drives the feeding sprocket 3 and controls the driving of themotors 7M and 3M. In addition, the controller 15 is connected to thecomponent detecting sensor 28 a, the sprocket hole detecting sensor 28b, the following-tape detecting sensor 8, the intermediate sensor 10,and the feeding sprocket sensor 3 a which configure the sensor unit 11,and receives the detection signals from the sensors. Further, thecontroller 15 is connected to a state displaying section 16 a and anoperation switch group 16 b which are provided on the operation/displaypanel 16 (refer to FIG. 1) such that the controller 15 controls adisplay process performed by the state displaying section 16 a, receivesan operation signal input through the operation switch group 16 b, andtransmits and receives a signal to and from the component mountingapparatus through a communication unit 40 which corresponds to acommunication interface.

The processing function of the controller 15 will be described. Thecontroller 15 internally includes a sensing information storage unit 30,a component presence/absence determining unit 31, a component depletiondetermining unit 32, a following-tape transport processing unit 33, afollowing-tape transfer processing unit 34, a slippage detectionprocessing unit 35, a heading-of-component processing unit 36, apreceding-tape transport processing unit 37, a preceding-tape dischargeprocessing unit 38, and a component presence/absence information storageunit 39.

The sensing information storage unit 30 stores sensing informationdetected by the component detecting sensor 28 a, the sprocket holedetecting sensor 28 b, the following-tape detecting sensor 8, theintermediate sensor 10, and the feeding sprocket sensor 3 a. Thecontroller 15 performs control processes of the units based on thesensing information stored in the sensing information storage unit 30.

The component presence/absence determining unit 31 determines thepresence or absence of the electronic component P in the accommodationsection 21 a based on information from the sprocket hole detecting unit24 b and information from the electronic component detecting unit 24 a.In other words, the component presence/absence determining unit 31identifies the information obtained from the electronic componentdetecting unit 24 a when the accommodation section 21 a passes theelectronic component detecting unit 24 a, based on the information fromthe sprocket hole detecting unit 24 b, and determines the presence orabsence of the electronic component P in the accommodation section 21 awhich has passed the electronic component detecting unit, based onidentified information.

In this manner, the information obtained when the accommodation section21 a passes the electronic component detecting unit 24 a is identifiedbased on the information from the sprocket hole detecting unit 24 b andthereby, it is possible to perform the component detection with highaccuracy without the influence of variation of the passing speed of thecomponent supply tape 20 on the transport path 2. Hence, in the tapefeeder 1 according to the present embodiment, the controller 15 controlsthe component supply tape transport unit (the feeding sprocket 3 and thetransport sprocket mechanism 7) described above, based on thedetermination result of the component presence/absence determining unit31.

The component depletion determining unit 32 determines componentdepletion in the preceding tape 20 (1) based on the determination resultof the component presence/absence determining unit 31. In other words,when the determination result of the component presence/absencedetermining unit 31 indicates “absence” in one accommodation section 21a or “absence” consecutively a plurality of times, depletion of theelectronic components P in the preceding tape 20 (1) is determined.Based on the determination of the component depletion, the accommodationsection 21 a of the preceding tape 20 (1), in which the final componentPe (refer to FIG. 8) is accommodated, is identified and a preceding-tapedischarge instruction or a preceding-tape replacement instruction isoutput at a timing at which the final component Pe reaches the componentpicking-up position 14.

The following-tape transport processing unit 33 performs a process ofcausing the feeding sprocket 3 which corresponds to the inserted tapefeeding unit to transport the following tape 20 (2) inserted through theinsertion port 2 a. In other words, the following-tape transportprocessing unit 33 performs the process in which the leading end portion20 s of the following tape 20 (2) is fed to the following-tape stopper 9which means a standby position, the following tape 20 (2) is temporarilystopped, and the following tape 20 (2) is transported to a deliveryposition to the first sprocket 5 of the transport sprocket mechanism 7after the preceding tape 20 (1) is discharged.

The following-tape transfer processing unit 34 performs a process ofdelivering the leading end portion 20 s of the following tape 20 (2)transported through the process of the following-tape transportprocessing unit 33 after the depleted preceding tape 20 (1) isdischarged by the transport sprocket mechanism 7. In other words, thefollowing-tape transfer processing unit 34 corresponding to asubsequent-tape delivery unit that causes the feeding sprocket 3 totransport the following tape 20 (2) which is the subsequent componentsupply tape 20 on the transport path 2 and that delivers a leading endportion 20 s of the following tape 20 (2) to the transport sprocketmechanism 7, after the transport sprocket mechanism 7 transports thedepleted preceding tape 20 (1).

The slippage detection processing unit 35 performs a process ofdetecting “slippage” occurring when the transport sprocket mechanism 7transports the following tape 20 (2). In other words, the slippagedetection processing unit 35 detects “slippage” which means tape feedingslippage occurring when the following tape 20 (2) which is fed by pitchby the feeding sprocket 3 is delivered to the transport sprocketmechanism 7. In other words, the slippage detection processing unit 35corresponds to a slippage detector that detects slippage occurring whenthe transport sprocket mechanism 7 which corresponds to the componentsupply tape transport unit transports the component supply tape 20(following tape 20 (2)).

Here, “slippage” means abnormal tape feeding due to the rotation of thefirst sprocket 5 in a state in which feeding claws do not normallyengage with the sprocket holes 21 b in a tape feeding method in whichthe first sprocket 5 is caused to rotate in a state in which the feedingclaws of the first sprocket 5 engage with the sprocket holes 21 b formedin the base tape 21 at regular pitches. “Slippage” causes a differenceto be generated between a tape feeding amount on data, obtained througha rotation amount of the first sprocket 5 and a tape feeding amount bywhich the following tape 20 (2) is actually transported. As a result,when the following tape 20 (2) is fed to the component picking-upposition 14 and the leading component Ps is positioned at the componentpicking-up position 14, a tape feeding error occurs by the amount of“slippage”.

According to the present embodiment, the heading-of-component processingunit 36 to be described below corrects such a tape feeding error. Inother words, the heading-of-component processing unit 36 corrects thetransport of the following tape 20 (2) by the transport sprocketmechanism 7 based on the slippage detected by the slippage detectionprocessing unit 35 and thereby, a heading-of-component process ofpositioning the leading component Ps in the following tape 20 (2) at thecomponent picking-up position 14 is performed.

Therefore, the heading-of-component processing unit 36 corrects thetransport of the component supply tape 20 (following tape 20 (2)) by thetransport sprocket mechanism 7 which corresponds to the component supplytape transport unit, based on the slippage detected by the slippagedetection processing unit 35 which corresponds to the slippage detector,and corresponds to the transport correction unit that transports theelectronic component P detected by the electronic component detectingunit 24 a to a predetermined position.

The slippage detector will be described. The slippage detector includesa tape detector having a function of detecting an actual feeding amountof the component supply tape 20. The feeding amount (K1) of thecomponent supply tape 20 by the transport sprocket mechanism 7 iscompared to the actual feeding amount (K2) of the component supply tape20, which has been detected by the tape detector, such that slippage isquantitatively detected.

As an example of the tape detector, a configuration may be used, inwhich shapes regularly formed in the component supply tape 20, forexample, the accommodation sections 21 a or the sprocket holes 21 b, aredetected by the detection function of the intermediate sensor 10, thesensor unit 11, or the like. According to the configuration, it ispossible to perform slippage detection using features of the shape orconfiguration of the component supply tape 20 and it is advantageousthat no additional devising are required. Specific examples of theconfiguration include an example in which the sprocket hole detectingunit 24 b provided in the sensor unit 11 is used. In the specificexample, the sprocket hole 21 b is optically detected by the sprockethole detecting unit 24 b. Pitch feeding times (K1) of the transportsprocket mechanism 7 is compared to the number (K2) of the sprocketholes 21 b detected by the sprocket hole detecting unit 24 b, by aprocessing function of the slippage detection processing unit 35 suchthat slippage is detected.

In the slippage detection process, counting of pitch transport times K1and the number K2 of the sprocket holes is performed until feeding timesof the feeding motor 3M reaches predetermined times (feeding times untilthe leading end portion 20 s of the following tape 20 (2) reaches apredetermined position, that is, feeding times for reliably resolvingslippage) and a calculation of the slippage times Ks=(K1−K2) isperformed. In the heading-of-component process by theheading-of-component processing unit 36, in which the leading componentPs is positioned at the component picking-up position 14, the correctionof the pitch feeding times is performed based on the slippage detectionresult described above. Here, the following two cases exist depending onwhether or not the leading component Ps is detected before the slippagedetecting process.

First, in a case (case 1) where the leading component Ps is detectedbefore the slippage detecting process is completed, pitch feeding timesKn required for the heading-of-component is calculated after theslippage detecting process and pitch feeding is performed by the pitchfeeding times Kn. The pitch feeding times Kn is obtained as follows.Here, the necessary pitch feeding times (feeding amount) until theleading component Ps which is positioned of the sensor unit 11 istransported to the component picking-up position 14 is Ka and pitchfeeding times until the slippage detecting process is completed afterthe leading component Ps is detected by the sensor unit 11 is Kb. Inthis case, the pitch feeding times Kn required for theheading-of-component is obtained using a calculating equation,Kn=Ka−Kb+Ks.

Meanwhile, in a case (case 2) where the leading component Ps is detectedafter the slippage detecting process, the pin of the first sprocket 5normally engages with the sprocket hole 21 b of the following tape 20(2) such that there is no need to consider slippage. Therefore, thepitch feeding times Kn required for the heading of component after thedetection of the leading component Ps satisfies Kn=Ka.

The preceding-tape transport processing unit 37 performs a process oftransporting the electronic components P accommodated in theaccommodation section 21 a to the component picking-up position 14, inorder, by transporting the preceding tape 20 (1) by pitch, based on theinstruction from the component mounting apparatus. The preceding-tapedischarge processing unit 38 performs a process of discharging an emptytape part of the preceding tape 20 (1) through the discharge port 2 bafter the final component Pe of the preceding tape 20 (1) reaches thecomponent picking-up position 14. In other words, the preceding-tapedischarge processing unit 38 which corresponds to a tape dischargeprocessing unit drives the transport sprocket mechanism 7 until feedingamounts of the component supply tape 20 by the transport sprocketmechanism 7 are accumulated to become a predetermined feeding amountafter the passing of the terminal end portion 20 e of the componentsupply tape 20 is detected by the tape detecting sensor such as theintermediate sensor 10 on the transport path 2.

The component presence/absence information storage unit 39 stores thepresence or absence of a component in the accommodation sections 21 a ofthe component supply tape 20, which is detected by the componentpresence/absence determining unit 31, that is, the accommodationsections 21 a present between the sensor unit 11 and the componentpicking-up position 14, for each accommodation section 21 a. In thepreceding-tape transport process by the preceding-tape transportprocessing unit 37, how many pitch feeding times the preceding tape 20(1) is fed is controlled based on the component presence/absenceinformation for each accommodation section 21 a, which is stored in thecomponent presence/absence information storage unit 39.

In the configuration described above, the electronic component detectingunit 24 a provided in the sensor unit 11, that is, the electroniccomponent detecting unit 24 a that detects the electronic component Paccommodated in the accommodation section 21 a of the component supplytape 20 on the transport path 2, is not an essential element in a viewpoint of an object of the heading of component by positioning theaccommodation section 21 a, in which the leading component Ps isaccommodated, to the component picking-up position 14.

In other words, when the number of empty accommodation sections in aleading end part of the component supply tape 20 is strictly inspectedsuch that, it is ensured that N accommodation sections 21 a from theleading end portion 20 s are always empty, the position of the leadingcomponent Ps is uniquely identified in the leading end part of thecomponent supply tape 20. Therefore, when information of the position ofthe leading component Ps and information of the position of thecomponent picking-up position 14 on the transport path 2 are given inadvance, it is possible to perform the heading of the leading componentPs without identifying an actual leading component Ps. In thisconfiguration, the heading-of-component processing unit 36 functions asthe transport correction unit that corrects the transporting of thecomponent supply tape 20 by the transport sprocket mechanism 7 based onthe slippage detected by the slippage detector described above, with theinformation of the position described above as a prerequisite.

Next, a component presence/absence determining process will be describedwith reference to FIG. 6. The component presence/absence determinationis performed using a process function of the component presence/absencedetermining unit 31 (refer to FIG. 7) which is included in thecontroller 15. The component presence/absence determining unit 31identifies a range of the detection waveform corresponding to theaccommodation section 21 a of the output information on the componentdetecting sensor 28 a which is stored in the sensing information storageunit 30. Specifically, the timings H1 and H2 are detected using theoutput of the sprocket hole detecting sensor 28 b and timings T1 and T2obtained by a delay of standard delay time DT from the timings H1 and H2are determined. According to the present example, since theaccommodation sections 21 a are provided at a pitch which is half thepitch of the sprocket hole 21 b, the component presence/absencedetermining unit 31 equally divides a zone between the timings T1 to T2(first cycle) into two zones of a first zone A1 and a second zone A2with a time reference. The first zone A1 and the second zone A2correspond to the accommodation sections 21 a, one to one, and contain acontinuous detection waveform (hereinafter, referred to as a continuouswaveform) obtained between time points of immediately before theaccommodation sections 21 a corresponding to the zones A1 and A2 passthe component detecting sensor 28 a and immediately after the passing.

Next, the component presence/absence determining unit 31 evaluates theoutput of the component detecting sensor 28 a in the respective firstzone A1 and the second zone A2 and the presence or absence of acomponent in the accommodation section 21 a which has passed thecomponent detecting sensor 28 a is determined by determining whether theoutput corresponds to the detection waveform Wc. The determination isperformed in a method in which an evaluation parameter such as a meanvalue, an integrated value, or the like, of the detection waveform, iscompared to a preset threshold value based on a componentpresence/absence pattern illustrated in FIG. 4A, or the like. In thismanner, the component presence/absence determining unit 31 identifiesoutput information (detection waveform) obtained from the componentdetecting sensor 28 a, based on the information from the sprocket holedetecting sensor 28 b, when the accommodation section 21 a passes thecomponent detecting sensor 28 a and the presence or absence of theelectronic component in the passing accommodation section, based on theidentified output information.

The component presence/absence determining unit 31 also executes thesame process in a cycle from a second cycle S2 when the componentpresence/absence determining process is ended in a first cycle S1. Thestandard delay time DT used when the timings T1 and T2 are determined inthe component presence/absence determining process is used to adjust thetimings T1 and T2 such that the timings T1 and T2 are not overlapped inthe continuous waveform and the standard delay time DT does not have tobe necessarily used. For example, in a case where the offset dimension Dis set such that the component detecting sensor 28 a does not detect theaccommodation section 21 a but detects a portion of the component supplytape 20 when the sprocket hole detecting sensor 28 b detects the passingof the sprocket hole, the component presence/absence determining processmay be performed with the timings H1 and H2 as the timings T1 and T2without any delay.

Next, with reference to FIG. 8 and FIG. 9, the tape feeding operation ofthe component supply tape 20 in the tape feeder 1 will be described.Here, an electronic component supply method in which the componentsupply tape 20 illustrated in FIGS. 2A and 2B is inserted through theinsertion port 2 a of the transport path 2 and transported to thecomponent picking-up position 14 along the transport path 2 and theelectronic component P accommodated in the accommodation section 21 a issupplied to the component mounting apparatus is illustrated and aprocessing method of the component supply tape 20 in the tape feeder 1is illustrated.

(1) to (5) in FIG. 8 and (1) to (4) in FIG. 9 schematically illustrate asimplified series of tape feeding operations of the preceding tape 20(1) and the following tape 20 (2) which is additionally refilled to besubsequent to the preceding tape 20 (1) in the same tape feeder 1. Thepreceding tape 20 (1) and the following tape 20 (2) are discharged fromthe discharge port 2 b passing, from the upstream side, the feedingsprocket 3, the following-tape stopper 9 and the following-tapedetecting sensor 8, the intermediate sensor 10, the sensor unit 11, thefirst sprocket 5, and the component picking-up position 14, in thisorder. In such tape feeding, arrows by solid lines indicate a continuousfeeding transport operation in which the tape feeding of the componentsupply tape 20 is continuously performed and arrows by dotted linesindicate a pitch feeding transport operation in which the tape feedingof the component supply tape 20 is intermittently performed.

(1) in FIG. 8 illustrates a state in which an operator inserts thefollowing tape 20 (2) through the insertion port 2 a based on acomponent refilling instruction in a state in which the component supplyis continued by the pitch feeding (an arrow c) of the preceding tape 20(1) in the tape feeder 1. Here, the leading end portion 20 s of thefollowing tape 20 (2) is inserted to the downstream side passing thefeeding sprocket 3. In this manner, the feeding sprocket 3 rotates, thedriving of the feeding motor 3M is started by detecting of the rotationby the feeding sprocket sensor 3 a, and the transport of the followingtape 20 (2) is performed.

As illustrated in (2) in FIG. 8, the leading end portion 20 s of thefollowing tape 20 (2) reaches the following-tape stopper 9 and thefollowing-tape detecting sensor 8 detects the following tape 20 (2) andthereby, the driving of the feeding motor 3M is stopped and thefollowing tape 20 (2) is stopped. Then, the following tape 20 (2) waitsat the position when the terminal end portion 20 e of the preceding tape20 (1) which is repetitively fed by pitch (an arrow d) passes theintermediate sensor 10. The operation illustrated in (1) and (2) in FIG.8 described above corresponds to a following-tape preparing step inwhich the subsequently refilled following tape 20 (2) is prepared in apitch feeding process of the preceding tape 20 (1).

The following-tape preparing step is executed by controlling therespective units by the following-tape transport processing unit 33(refer to FIG. 7). In other words, after the intermediate sensor 10which is the tape detecting sensor detects the passing of the terminalend portion 20 e of the preceding component supply tape 20 (precedingtape 20 (1)), the following-tape transport processing unit 33 functionsas a subsequent-tape transport unit that causes the feeding sprocket 3to transport the following tape 20 (2) which is the subsequent componentsupply tape 20 to a position which is detected by the intermediatesensor 10, on the transport path 2.

Then, as illustrated in (3) and (4) in FIG. 8, the preceding tape 20 (1)is further fed (arrows e and f) by pitch. In other words, the transportmotor 7M feeds the preceding tape 20 (1) by pitch and transports theelectronic components P accommodated in the accommodation sections 21 ato the component picking-up position 14 in order, based on theinstruction from the component mounting apparatus. After theintermediate sensor 10 as the tape detecting sensor detects the passingof the terminal end portion 20 e of the preceding tape 20 (1), asillustrated in (4) in FIG. 8, the feeding sprocket 3 which correspondsto the inserted tape feeding unit continuously feeds and transports (anarrow g) to a position at which the intermediate sensor 10 can detectthe subsequent tape 20 (2) on the transport path 2. When theintermediate sensor 10 detects the following tape 20 (2), the feedingmotor 3M is stopped and the following tape 20 (2) waits at the position.

In the pitch feeding of the preceding tape 20 (1) illustrated in (2) and(3) in FIG. 8, the component presence/absence determining unit 31performs the presence or absence determination of the electroniccomponent P in the accommodation section 21 a passing the sensor unit11, using the output from the sensor unit 11. The componentpresence/absence determination result is stored as the componentpresence/absence information in association with the respectiveaccommodation sections 21 a in the component presence/absenceinformation storage unit 39. The component depletion determination, theheading-of-component process, and the tape discharge process to bedescribed below are executed based on the component presence/absenceinformation stored in the component presence/absence information storageunit 39.

In a case where the component presence/absence determining unit 31determines “absence” with respect to one accommodation section 21 a, or“absence” consecutively, the controller 15 determines that the finalcomponent Pe is accommodated in the accommodation section 21 a which isdetermined as “presence” at the last time and calculates the pitchfeeding times (final component pitch feeding times) which are neededuntil the final component Pe reaches the component picking-up position14. Hence, when the tape feeding of the preceding tape 20 (1) isperformed, subtraction of the final component pitch feeding times isperformed whenever the pitch feeding is performed.

(4) in FIG. 8 illustrates a state in which the final component pitchfeeding times becomes zero and the final component Pe reaches thecomponent picking-up position 14 in the tape feeding of the precedingtape 20 (1). In this state, the controller 15 notifies the componentmounting apparatus of an indication thereof. The component mountingapparatus that receives the notification outputs the preceding-tapedischarge instruction or the preceding-tape replacement instruction tothe tape feeder 1 after the mounting head picks up the final componentPe at the component picking-up position 14.

The operation illustrated in (3) and (4) in FIG. 8 corresponds to apreceding-tape pitch feeding step in which the preceding tape 20 (1) isfed by pitch, the sensor unit 11 performs the component presence/absencedetection, and the pitch feeding is repetitively executed until thefinal component Pe reaches the component picking-up position 14. Then,the preceding-tape pitch feeding step is executed by controlling therespective units by the preceding-tape transport processing unit 37(refer to FIG. 7) of the controller 15.

In other words, when the determination result of the componentpresence/absence determining unit 31 is “absence” or “absence” aplurality of consecutive times, the controller 15 determines that theelectronic components P are depleted in the preceding tape 20 (1) andnotifies the component mounting apparatus of the indication thereof.After the final component Pe is picked up at the component picking-upposition 14, the controller 15 causes the transport sprocket mechanism 7which corresponds to the component supply tape transport unit totransport the depleted preceding tape 20 (1) to the discharge port 2 b.

In addition, when the determination result of the componentpresence/absence determining unit 31 is first “presence” after theleading end portion 20 s of the following tape 20 (2) passes theelectronic component detecting unit 24 a, the controller 15 determinesthat the leading component Ps which is the leading electronic componentP of the following tape 20 (2) is detected and causes the transportsprocket mechanism 7 which corresponds to the component supply tapetransport unit to transport the following tape 20 (2) such that theleading component Ps is positioned at the component picking-up position14.

When the preceding-tape discharge instruction or the preceding-tapereplacement instruction is output, the preceding-tape dischargeprocessing unit 38 controls the respective units and thereby apreceding-tape discharge process to be described below is executed suchthat the depleted preceding tape 20 (1) is discharged after the finalcomponent Pe is picked up. Here, in a stage in which the final componentPe reaches the component picking-up position 14, there are two casesdepending on whether or not the intermediate sensor 10 disposed on thetransport path 2 already detects the passing of the terminal end portion20 e of the preceding tape 20 (1).

First, in the case (case 1) where the passing of the terminal endportion 20 e is already detected, a tape feeding amount (driving time ofthe transport motor 7M, an encoder pulse amount, pitch feeding times, orthe like) required for the preceding tape 20 (1) to be transported fromthe intermediate sensor 10 to the discharge port 2 b is already foundout. Thus, the preceding-tape discharge processing unit 38 calculates aremaining tape feeding amount required for the preceding tape 20 (1) tobe discharged using the timing at which the preceding tape 20 (1) passesthe intermediate sensor 10 and the tape feeding amount required for thefinal component Pe to reach the component picking-up position 14 fromthe timing, and the preceding-tape discharge processing unit 38 drivesthe transport motor 7M by the tape feeding amount. In this manner, afterthe final component Pe is picked up, the depleted preceding tape 20 (1)is discharged (an arrow h) from the discharge port 2 b through thecontinuous feeding transport.

Meanwhile, in a stage in which the final component Pe reaches thecomponent picking-up position 14 and in the case (case 2) in which thepassing of the terminal end portion 20 e has yet to be detected, thetransport motor 7M is driven as is and the discharge of the precedingtape 20 (1) is started. In the process of the tape feeding operation forthe discharge, when the intermediate sensor 10 detects the passing ofthe terminal end portion 20 e, the transport motor 7M is driven by anamount required for the tape feeding of the preceding tape 20 (1) fromthe position of the intermediate sensor 10 to the discharge port 2 b. Inthis manner, after the final component Pe is picked up, the depletedpreceding tape 20 (1) is discharged from the discharge port 2 b throughthe continuous feeding transport.

After the final component Pe (last component) is picked up at thecomponent picking-up position 14 after the component depletiondetermining unit 32 determines depletion, the preceding-tape dischargeprocessing unit 38 functions as a tape discharge processing unit thattransports the depleted preceding tape 20 (1) in the component supplytape transport unit to the discharge port 2 b through the continuousfeeding transport.

In addition, when the terminal end portion 20 e of the preceding tape 20(1) passes the intermediate sensor 10, the feeding motor 3M is drivenand the transport of the following tape 20 (2) is started. Asillustrated in (4) in FIG. 8, when the intermediate sensor 10 detectsthe leading end portion 20 s of the following tape 20 (2), the feedingmotor 3M is stopped and the following tape 20 (2) waits at the position.Next, as illustrated in (5) in FIG. 8 and (1) in FIG. 9, the terminalend portion 20 e of the preceding tape 20 (1) passes the sensor unit 11,the feeding motor 3M is driven and the transport (an arrow i) of thefollowing tape 20 (2) is started through the continuous feeding. Whenthe sensor unit 11 detects the leading end portion 20 s of the followingtape 20 (2), the feeding motor 3M is stopped. At this timing, thedetection of the leading component Ps passing the sensor unit 11 isstarted.

When the discharge (an arrow j) of the preceding tape 20 (1) iscompleted in (1) in FIG. 9, the following tape 20 (2) is transported (anarrow k) through the continuous feeding and a following-tape transferprocess of causing the following tape 20 (2) to engage with the firstsprocket 5 of the transport sprocket mechanism 7 and of transferring thefollowing tape 20 (2) is started. First, the feeding motor 3M is drivenand the following tape 20 (2) is transported (an arrow 1) through thecontinuous feeding until the leading end portion 20 s approaches thevicinity of the first sprocket 5 as illustrated in (2) in FIG. 9.

Next, when the leading end portion 20 s approaches the vicinity of thefirst sprocket 5, the tape feeding operation of the feeding motor 3M ischanged to the pitch feeding (an arrow m) and the tape feeding operationof the transport motor 7M that drives the first sprocket 5 is alsochanged to the pitch feeding as illustrated in (3) in FIG. 9. At thattime, both counting of pitch transport times K1 of the transport motor7M and counting of the number K2 of the sprocket holes 21 b which havepassed the sprocket hole detecting sensor 28 b are started. The pitchtransport of the feeding motor 3M is stopped at a timing at which it isconsidered that the leading end portion 20 s of the following tape 20(2) passes the first sprocket 5 and then, only the transport motor 7M isdriven and performs the tape transport (an arrow n) through the pitchfeeding of the following tape 20 (2).

The leading end portion 20 s of the following tape 20 (2) passes thecomponent picking-up position 14, the leading component Ps reaches thecomponent picking-up position 14 as illustrated in (4) in FIG. 9 andthereby, the heading of component of the following tape 20 (2) iscompleted. Then, the leading component Ps is picked up by the mountinghead of the component mounting apparatus and then, the picking-up of thecomponent from the following tape 20 (2) as a target is started.

In other words, in the electronic component supply method describedabove, the component supply tape 20 having the leading end portion 20 sinserted through the insertion port 2 a on the transport path 2 istransported toward the discharge port 2 b on the transport path 2 by thefeeding sprocket 3 which is the inserted tape feeding unit ((1) in FIG.8 to (2) in FIG. 9)) (inserted tape transporting step). In the insertedtape transporting step, the leading component Ps (leading electroniccomponent) of the component supply tape 20 is detected ((1) in FIG. 9)(leading component detecting step).

Next, the leading end portion 20 s of the component supply tape 20 istransferred to the transport sprocket mechanism 7 which is the componentsupply tape transport unit disposed on the discharge port 2 b side onthe transport path 2 ((3) in FIG. 9) (transferring step) and theslippage of the component supply tape 20 is detected in the transferringstep (slippage detecting step). A transport operation by the transportsprocket mechanism 7 is performed in the margin by an amount of slippagedetected in the slippage detecting step and thereby, the leadingcomponent Ps is transported to the component picking-up position 14which is the predetermined position ((4) in FIG. 9) (heading ofcomponent step).

In the slippage detecting step described above, the feeding amount (K1)of the transport sprocket mechanism 7 is compared to the actual feedingamount (K2) of the component supply tape 20 such that slippage isdetected. Specifically, the pitch feeding times (K1) of the transportsprocket mechanism 7 are compared to the number (K2) of the sprocketholes detected by the sprocket hole detecting unit 24 b of the sensorunit 11 which corresponds to the sprocket hole detector such thatslippage is detected.

As described above, in the tape feeder 1 and the component supply methodby the tape feeder 1 according to the present embodiment, when thecomponent supply tape 20 is transported to the component picking-upposition 14 and the electronic component P accommodated in theaccommodation section 21 a is supplied to the component mountingapparatus, the component supply tape 20 transported along the transportpath 2 is transported toward the discharge port 2 b and slippage, whichoccurs in the transport of the component supply tape 20 by the transportsprocket mechanism 7 that positions the accommodation section 21 a atthe component picking-up position 14 on the upstream side from thedischarge port 2 b, is detected by the slippage detector such that thetransport of the component supply tape 20 by the transport sprocketmechanism 7 is corrected based on detected slippage.

In this manner, the tape feeding error due to slippage occurring whenthe following tape 20 (2) which is the subsequent component supply tape20 is transferred to the transport sprocket mechanism 7 is correctedsuch that it is possible to position the subsequent component supplytape 20 exactly at the component picking-up position 14.

An electronic component supply apparatus and an electronic componentsupply method of the embodiments is effective in that it is possible toposition the subsequent component supply tape exactly at the componentpicking-up position and is applicable in a component mounting field inwhich an electronic component is mounted on a substrate.

What is claimed is:
 1. An electronic component supply apparatus thattransports a component supply tape which has a plurality ofaccommodation sections and sprocket holes formed at regular intervalsand which accommodates an electronic component in each of theaccommodation sections, to a component picking-up position and thatsupplies the electronic component accommodated in the accommodationsection to a component mounting apparatus, the electronic componentsupply apparatus comprising: a main body unit which is provided with atransport path that guides the component supply tape from an insertionport, through which the component supply tape is inserted, to adischarge port, through which the component supply tape is discharged;an inserted tape feeding unit that transports the component supply tapeinserted through the insertion port toward the discharge port along thetransport path; a component supply tape transport unit that transportsthe component supply tape transported along the transport path, towardthe discharge port, and positions the accommodation section at thecomponent picking-up position on an upstream side from the dischargeport; a slippage detector that detects slippage occurring in thetransport of the component supply tape by the component supply tapetransport unit; and a transport correction unit that corrects thetransport of the component supply tape by the component supply tapetransport unit based on the slippage detected by the slippage detector.2. The electronic component supply apparatus according to claim 1,wherein the slippage detector includes a tape detector that detects anactual feeding amount of the component supply tape, and compares afeeding amount of the component supply tape transport unit to the actualfeeding amount of the component supply tape to detect the slippage. 3.The electronic component supply apparatus according to claim 2, whereinthe tape detector detects shapes regularly formed on the componentsupply tape.
 4. The electronic component supply apparatus according toclaim 3, wherein the tape detector is a sprocket hole detector thatoptically detects at least one of the sprocket holes in the componentsupply tape.
 5. The electronic component supply apparatus according toclaim 4, wherein the slippage detector compares pitch feeding times ofthe component supply tape transport unit to the number of the sprocketholes detected by the sprocket hole detector to detect slippage.
 6. Anelectronic component supply apparatus that transports a component supplytape which has a plurality of accommodation sections and sprocket holesformed at regular intervals and which accommodates an electroniccomponent in each of the accommodation sections, to a componentpicking-up position and that supplies the electronic componentaccommodated in the accommodation section to a component mountingapparatus, the electronic component supply apparatus comprising: a mainbody unit which is provided with a transport path that guides thecomponent supply tape from an insertion port, through which thecomponent supply tape is inserted, to a discharge port, through whichthe component supply tape is discharged; an inserted tape feeding unitthat transports the component supply tape inserted through the insertionport toward the discharge port along the transport path; an electroniccomponent detecting unit that detects an electronic componentaccommodated in the accommodation section of the component supply tapein the transport path; a component supply tape transport unit thattransports the component supply tape transported along the transportpath, toward the discharge port, and positions the accommodation sectionat the component picking-up position on an upstream side from thedischarge port; a slippage detector that detects slippage occurring inthe transport of the component supply tape by the component supply tapetransport unit; and a transport correction unit that corrects thetransport of the component supply tape by the component supply tapetransport unit based on the slippage detected by the slippage detectorand transports the electronic component detected by the electroniccomponent detecting unit to a predetermined position.
 7. The electroniccomponent supply apparatus according to claim 6, wherein the slippagedetector includes a tape detector that detects an actual feeding amountof the component supply tape, compares a feeding amount of the componentsupply tape transport unit to the actual feeding amount of the componentsupply tape to detect the slippage.
 8. The electronic component supplyapparatus according to claim 7, wherein the tape detector is a sprockethole detector that optically detects at least one of the sprocket holesin the component supply tape.
 9. The electronic component supplyapparatus according to claim 8, wherein the slippage detector comparespitch feeding times of the component supply tape transport unit to thenumber of the sprocket holes detected by the sprocket hole detector todetect the slippage.
 10. An electronic component supply method oftransporting a component supply tape which has a plurality ofaccommodation sections and sprocket holes formed at regular intervalsand which accommodates an electronic component in each of theaccommodation sections, to a component picking-up position, andsupplying the electronic component accommodated in the accommodationsection to a component mounting apparatus, the electronic componentsupply method comprising: transporting the component supply tape havinga leading end portion inserted through an insertion port of a transportpath toward a discharge port of the transport path by an inserted tapefeeding unit; detecting a leading electronic component of the componentsupply tape in the transporting of the component supply tape;transferring the leading end portion of the component supply tape to acomponent supply tape transport unit disposed on a discharge port sideof the transport path; detecting slippage of the component supply tapein the transferring of the leading end portion; and transporting theleading electronic component to a predetermined position by performingan additional transport operation corresponding to the detected slippageby the component supply tape transport unit.
 11. The electroniccomponent supply method according to claim 10, wherein, in the slippagedetecting, a feeding amount of the component supply tape transport unitis compared to an actual feeding amount of the component supply tape todetect the slippage.
 12. The electronic component supply methodaccording to claim 11, wherein, in the slippage detecting, pitch feedingtimes of the component supply tape transport unit is compared to thenumber of the sprocket holes detected by the sprocket hole detector todetect the slippage.